In a nutshell: Western Digital plans to begin mass-producing 162-layer BiCS6 3D NAND, which is probably going for use in PCIe 5 SSDs by the tip of this yr. The corporate can also be engaged on NAND with 200+ layers meant for datacenter storage, PLC, and methods to bond collectively a number of 3D NAND wafers to extend the variety of layers.
Western Digital, along with companion Kioxia, simply gave us a take a look at their roadmap for the following few years of NAND growth. The corporate plans to introduce its sixth technology BiCS quickly, which can characteristic 162 layers in TLC and QLC configurations.
Whereas that may not sound so spectacular contemplating opponents like Micron have had 176-layer NAND for some time now, WD claims they are going to shrink the reminiscence cell dimension through the use of a brand new materials, leading to smaller die sizes.
The corporate hopes that this can permit them to construct cheaper storage units that carry out simply as properly. Mass manufacturing of BiCS6 3D NAND is scheduled to begin in late 2022, with WD planning to make use of these chips in merchandise starting from low-cost USB drives to PCIe 5.0 SSDs.
WD additionally talked about their upcoming BiCS+ reminiscence with over 200 layers, which is about to reach by 2024. It should characteristic 55 % extra bits per wafer, 60 % greater switch velocity, and a 15 % greater write velocity in comparison with BiCS6.
It is price noting that BiCS+ is supposed for use solely in datacenter SSDs, as the corporate plans to supply a special class of 2xx-layer NAND for client storage, dubbed BiCS-Y.
Western Digital moreover shared that they’re engaged on a number of applied sciences to enhance density and capability, together with PLC, and that they are planning to construct NAND with 500+ layers inside the subsequent decade.